ASUS Prime H370M-Plus



ASUS PRIME H370M-PLUS MB (INTEL H370) LGA1151
מק"ט: 18773
אתר היצרן: לחץ למעבר לאתר היצרן

 

ערכת שבבים

Intel® H370

זיכרון

4 x DIMM, Max. 64GB, DDR4 2666/2400/2133 MHz Non-ECC, Un-buffered Memory *
Dual Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
** Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists).
* The maximum memory frequency supported varies by processor.
** DDR4 2666MHz and higher memory modules will run at max. 2666MHz on Intel® 8th Gen. 6-core or higher processors.

גרפיקה

Integrated Graphics Processor- Intel® HD Graphics support
Multi-VGA output support : HDMI/DVI-D/D-Sub ports
- Supports HDMI 1.4b with max. resolution 4096 x 2160 @ 24 Hz / 2560 x 1600 @ 60 Hz
- Supports DVI-D with max. resolution 1920 x 1200 @ 60 Hz
- Supports D-sub with max. resolution 1920 x 1200 @ 60 Hz
Maximum shared memory of 1024 MB (for iGPU exclusively)
Supports Intel® InTru™ 3D, Quick Sync Video, Clear Video HD Technology, Insider™

חריצי הרחבה

1 x PCIe 3.0/2.0 x16 (x16 mode)
1 x PCIe 3.0/2.0 x16 (max at x4 mode)
2 x PCIe 3.0/2.0 x1

אחסון

Intel® H370 Chipset :
1 x M.2 Socket 3, , with M Key, type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 X2 mode)*1
1 x M.2 Socket 3, , with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode)
6 x SATA 6Gb/s port(s), gray
Support Raid 0, 1, 5, 10
Intel® Optane™ Memory Ready

רשת

Intel® I219V, 1 x Gigabit LAN Controller(s)
ASUS LAN Guard

אודיו Realtek® ALC887 8-Channel High Definition Audio CODEC
- Supports : Jack-detection, Front Panel Jack-retasking
Audio Feature :
- Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference
- Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals
- Premium Japanese audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity
יציאות USB Intel® H370 Chipset :
2 x USB 3.1 Gen 2 up to 10Gbps port(s) (2 at back panel, teal blue, Type-A)
Intel® H370 Chipset :
5 x USB 3.1 Gen 1 up to 5Gbps port(s) (3 at back panel, , Type-A + USB Type-CTM, 2 at mid-board)
Intel® H370 Chipset :
6 x USB 2.0 port(s) (2 at back panel, , 4 at mid-board)
כניסות/ יציאות אחוריות 1 x PS/2 keyboard/mouse combo port(s)
1 x DVI-D
1 x D-Sub
1 x HDMI
1 x LAN (RJ45) port(s)
2 x USB 3.1 Gen 2 (teal blue)up to 10Gbps
3 x USB 3.1 Gen 1 (blue) Type-A + USB Type-CTM,
2 x USB 2.0
3 x Audio jack(s)
כניסות/יציאות פנימיות 1 x USB 3.1 Gen 1(up to 5Gbps) connector(s) support(s) additional 2 USB 3.1 Gen 1 port(s) (19-pin)
2 x USB 2.0 connector(s) support(s) additional 4 USB 2.0 port(s)
1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 X2 mode)
1 x M.2 Socket 3 with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode)
1 x TPM header
6 x SATA 6Gb/s connector(s)
1 x CPU Fan connector(s) (1 x 4 -pin)
2 x Chassis Fan connector(s) (1 x 4 -pin)
1 x AIO_PUMP connector (1 x 4 -pin)
1 x S/PDIF out header(s)
1 x 24-pin EATX Power connector(s)
1 x 8-pin ATX 12V Power connector(s)
1 x Front panel audio connector(s) (AAFP)
1 x System panel(s) (Chassis intrusion header is inbuilt)
1 x Clear CMOS jumper(s)
1 x COM port header
1 x Mono Out header
מארז Micro ATX Form Factor
9.6 inch x 9.6 inch ( 24.4 cm x 24.4 cm )
* נפח האיחסון הפנוי לשימוש- נמוך מנפח האחסון הכולל של המכשיר, עקב התקנת מערכת ההפעלה, תוכנות וכדומה
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